Tenders Are Invited For Copper Pillar Flip Chip Assembly Technology

Tenders are invited for Copper Pillar Flip Chip Assembly Technology for High Density Components Expro+ Objective: To develop flip chip assembly capabilities for <15nm technology nodes and the bumping process for microbumps and/or copper pillars at wafer level.Description: This activity is aimed at the capabilities development within Europe of copper pillars and/or microbumps flip-chip assembly, that could further enable the next level of integration of SiP, which is 2.5D and 3D. Standard solder flip chip bumps are not capable to meet the high density level of advanced technology nodes <15nm and its reduced dimensions. For those technology nodes only microbumps and/or copper pillars are the most recognized and reliable assembly methods. The activity aims at developing both the copper pillars wafer bumping technology and the flip chip assembly capabilities onto a silicon substrate.The activity encompasses the following tasks: - Selection of the microbumps technology to be developed - Microbump wafer bumping development - Flip-chip assembly onto silicon substrate - Initial process characterization and definition of process key parameters.The expected deliverables of the activity include: - Breadboard demonstrator of the assembly capabilities - Initial characterization of the process performance (e.g. yield, failure modes, etc). The next steps of this activity will be the flip-chip assembly ontoasilicon interposer and/or another die, thus enabling 3D integration.Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to:http://www.esa.int/About_Us/Business_with_ESA/Small_and_Medium_Sized_Enterprises/Opportunities_for_SMEs/Procurement_policy_on_fair_access_for_SMEs_-_the_C1-C4_Clauses Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open