Tenders are invited for Advanced Chip Cooling for High Power and High Frequency Components Expro + ADVANCED CHIP COOLING FOR HIGH POWER AND HIGH FREQUENCY COMPONENTS EXPRO + Tender Action Number: 1-13330 Activity Number: 1000045821 Clarification Request Deadline 05/06/2026 13:00 CET Closing Date Extension Request Deadline 05/06/2026 13:00 CET Announcement Date 05/03/2026 Last Update On 16/04/2026 13:42 CET Update Reason Tender Action Issued Objective: To investigate on-chip cooling with micro-fluidics for High power/High frequency (>31.8GHz) RF GaN HEMTs. To integrate cooling close to the active area using semiconductor manufacturing techniques.Description: Junction temperature is a main limiting factor for power and RF applications. Any improvement in heat extraction immediately delivers better performance and reliability. Many efforts have been made to improve passive heat extraction like: silver sintered in die attach, thinner thickness, increased wafer thermal conductivity, and heat spreading in the substrate. Extracting heat actively is the logical next step for further improvements. Heat extraction through fluidic cooling allows for a much higher power in the components. Applications are now emerging for high-end processing (data center). The largest temperature gradient is commonly very close to the active area. Being able to extract heatbetter than through simple conduction translates into serious gains in efficiency. This activity aims to develop micro channels nextto the semiconductor device to extract the heat as close as possible from the source. Microchannels in combination with high dissipative materials (e.g. Diamond substrates) allow for the most promising solution whenever small dimensions are required. The overallthermal system should be complemented with highly dissipative substrates (eg. Direct Bonded Copper substrates, Ag-Diamond heat spreaders, etc.) that help conduct the heat away from the hot areas. This activity encompasses the following tasks: - Review of state-of-the-art solutions and estimation of their applicability for space applications. - Selection of both a fluidic cooling solution and a highly dissipative substrate that can be combined in a demonstrator. - Demonstration of the system on a heating element and characterization of the thermal performances with static and dynamic (pulsed current) measurement methods to quantify the thermal impedance and thermal capacity of the system (cumulative structure function). - Basic testing of the suitability for space applications (e.g. vacuum). - Theoretical study of the integration into fluidic cooling at the system level (ammonia pipes of the satellite). - Finalreport and perspectives for further development and industrial endorsement.Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to:http://www.esa.int/About_Us/Business_with_ESA/Small_and_Medium_Sized_Enterprises/Opportunities_for_SMEs/Procurement_policy_on_fair_access_for_SMEs_-_the_C1-C4_Clauses Read less Directorate Directorate of Tech, Eng. Quality Estabilishment ESTEC Open Date 16/04/2026 13:42 CET Closing Date 12/06/2026 13:00 CET ECOS Required No Classified No Price Range > 500 KEURO Authorised Contact Person Veljko Radojevic Initiating Service TEC-EDC IP Measure C1 Prog. Reference E/0901-01 - Technology Developme Tender Type Open Competition Open To Tenderers From AT+BE+CH+CZ+DE+DK+EE+GR+ES+FI+FR+GB+HU+IE+IT+LU+NL+NO+PL+PT+RO+SE+SI Technology Keywords 23-B-II-Silicon-Based EEE Components 23-B-III-RF Microwave and Millimetre Wave EEE Components 23-B-V-Hybrids and Micropackaging 23-B-VI-Power EEE Components 23-B-VII-Wide Band Gap Technologies Products Keywords 2-B-1-d-Discrete semiconductors (including diodes, transistors) 2-B-1-h-Monolithic Microcircuits (including MMICs) 2-B-1-i-Hybrid circuits 2-B-1-p-Optoelectronic Devices (including opto-couplers, LED, CCDs, displays, sensors) Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
