Miscellaneous Special-Purpose Machinery – Cmp Anlage. A System Is Being Purchased For Planarizing And Smoothing Surfaces Using Chemical Mechanical Polishing (Cmp) For Processing Substrates Up To 6 Inches In Size. The Device Is Intended To Be An Integral Part Of The Semiconductor Technology Clean Room In The Incyte Research Building At The Faculty Of Natural Sciences And Technology At The University Of Siegen. In The University Research Areas Of Sensor Technology And Materials Science, It Serves As A Central Cleanroom Device Component For Planarization And Smoothing Of A Wide Variety Of Substrates Or Samples, With Substrates Commonly Used In The Semiconductor Sector Primarily Being Addressed. The Facility Is Available To University Research Centers, The Center For Sensor Systems (Zess), The Center For Micro- And Nanochemistry And Engineering (Cµ), The Center For Innovative Materials (Cm), The Dfg-Funded Micro And Nanoanalytics Center Mnaf And Biomedical Sensor Research, As Well As External Cooperation Partners. In Addition, The Planarization System Should Be Centrally Available To All Researchers And Cooperation Partners At The University Of Siegen. The Universitys Project Budget Is A Maximum Of Eur 407,000.00 Gross. This Amount Includes All Taxes And Costs Incurred - Including Those From The Reverse Charge Procedure, Which The University Of Siegen Pays Directly To The Tax Office. If Necessary, The Awarding Authority Will Add This Tax Burden To The Offer Price When Evaluating The Offer. Offers That Exceed This Upper Limit Will Be Excluded From The Procurement Process. Please Note: Even If The Service Description Is Provided In English, All Tender Documents Must Be Completed And Submitted In German. Foreign Bidders Must Submit Equivalent Evidence From Their Responsible Home Authorities. These Must Also Be Included In A German Translation.
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