Tenders Are Invited For Microelectronic Machinery And Apparatus – National Infrastructure For Encapsulation Of Nano/Microelectronic Devices And Circuits (Nanopack)

Microelectronic Machinery And Apparatus – National Infrastructure For Encapsulation Of Nano/Microelectronic Devices And Circuits (Nanopack). The Subject Of The Contract Is The Supply National Infrastructure For Encapsulation Of Nano/Microelectronic Devices And Circuits (Nanopack). More Specifically, This Procurement Concerns One (1) System To Meet The Packaging Needs Of Micro/Nano Electronic Devices And Integrated Circuits, Which Will Include: 1. One (1) Tabletop System For Welding Cables And Mechanical Testers 2. One (1) Semi-Automatic Micro-Assembly System For Welding And Component Placement Applications. The Supply Includes The Obligation Of The Supplier To Guarantee Its Operation For At Least The Period Of Time Mentioned In The Specifications Of Each Type (See Appendix I - Tables Of Technical Specifications And Requirements). It Also Includes The Obligation Of The Supplier To Place And Install The Equipment, To Train The Competent Personnel Of The Ihdl In Matters Of Basic Operation And Maintenance Of The Equipment As Well As In Matters Of Safety And To Deliver It In Full Operation After A Technical Check Of Good Operation. In Addition, It Also Includes The Suppliers Obligation To Guarantee The Availability Of Spare Parts For At Least Seven (7) Years.