Tenders Are Invited For Modelling Of Effect Of Pcb Material On Assembly Reliability

Tenders are invited for Modelling of Effect of Pcb Material on Assembly Reliability Expro+ To characterize, quantify and model the impact of materials changes on the reliability of the assembly of a PCB.Printed circuit board (PCB) qualification and electronic assembly verification are strictly linked to the properties of the PCB base material. Changing PCB material can affect the coefficient of thermal expansion (CTE) of the board with direct impact on the reliability of the assembly. Changes of other properties such as Youngs modulus or glass transition temperature (Tg) can have less predictable impacts. Changing the PCB material not only requires the qualification of the PCB manufacturing but can also invalidate the verification status of an assembly process for certain EEE packages.The possible risk of having to repeat lengthy and costly assembly verification tests hampers the introduction of new materials in PCB manufacturing and prevents innovation. Modelling stresses in PCB assembly can give an understanding of the impact changing materials have and provide a tool to define the need for performing delta assembly verification.Often, changes in manufacturer, technology or materials are needed. This happens because of non-conformances observed at the manufacturer, unavailability of the manufacturer, or obsolescence. In these cases, a small change in technology is required. Such improvement levels are hampered by the need to repeat verification, as the impact is not fully characterized.Capability to assess potential impact can reduce delta verification processes, foster innovation, and improve supply chain sustainability.This activity encompasses the following tasks:Selection and refinement of elementary modelPhysical characterization of materials, solder alloys, and componentsTesting of assemblies (Through Hole Technology, Surface Mount Technology)Stress-strain modelling of assemblies and characterization of mechanical propertiesComparison of modelling and test results Read less Tender Link : https://esastar-publication-ext.sso.esa.int/ESATenderActions/filter/open