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    • Tenders Are Invited For Semiconductor Chip Equipment Procurement Project(1)

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    110628210
    You can view only after subscription.
    0677-2640J0312127/01
    Self-Funded
    Tenders Are Invited For Semiconductor Chip Equipment Procurement Project(1)
    NCB
    You can view only after subscription.
    Eastern Asia
    Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
    08-04-2026

    Work Detail

    Dry Etching Equipment, Polysilicon Dry Etcher, Metal Dry Etcher, CD Measurement System, Plasma Enhanced Chemical Vapor Deposition (PECVD) System, Plasma Enhanced Chemical Vapor Deposition (PECVD) System, Dry Photoresist Stripper, Stepper Lithography System, Wafer Particle Counter, Batch Wet Cleaning System, Coater Developer System, Oxidation & Diffusion Furnace (6-inch), Low Pressure Chemical Vapor Deposition (LPCVD) System, High Temperature Diffusion Furnace (6-inch), 4-inch LPCVD System, Projection Lithography System

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