Tenders Are Invited For Laboratory, Optical And Precision Equipments (Excl. Glasses) – Wafersäge

Laboratory, Optical And Precision Equipments (Excl. Glasses) – Wafersäge. The Institute Of Semiconductor Optics And Functional Interfaces (Ihfg) Has Developed Inas Quantum Dot (Qd) Structures That Emit In The C-Band Of The Telecommunications Sector And Are Based On Metamorphic Buffer Layers (Mmbs) Made Of Ingaas On A Gaas Platform. The Growth Of These Qd Structures Is Currently Optimized For Small Substrates (15 × 15 Mm2 Samples), But Efforts Are Underway To Scale It To Full 4-Inch Wafers. The Ihfg Aims To Exploit The Intrinsic Growth Gradient Across The Wafer To Develop Photonic Cavities (Particularly Bullseye Cavities) That Operate At Different Wavelengths For Different Quantum Applications. In Such A Case, Manufacturing The Bullseye Cavity Would Require Only A Single Epitaxial Growth Step, Followed By Wafer Bonding To A Silicon Carrier Wafer, Membrane Processing, And High-Precision Dicing To Produce Numerous Chips Covering A Range Of Cavity Wavelengths. Furthermore, For The Fabrication Of Waveguides Embedded With Telecom Qds, The Facets Of The Waveguides Must Be Prepared Using A Ductile Cutting Process To Achieve Optically Smooth Surfaces Suitable For Efficient Light Coupling. To Integrate The Qd Membrane Into Silicon-Based Photonic Integrated Platforms To Realize Iii-V/Si-Based Quantum Photonic Integrated Circuits (Qpics), The Silicon-Based Integrated Circuit Needs To Be Cut. A High-Precision Cutting Saw Is Essential For All Of The Applications Mentioned.