GTR 109529133
Bids Are Invited For Chips High-Throughput High-Resolution X-Ray Laminography/Tomography System For Advanced Packaged Semiconductor Devices And Substrates
ICB — International Competitive Bid
Closed
Northern America
Tender Information
GTR Reference
109529133
Tendering Authority
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Tender No
1333ND26QNB030031
Financer Name
Self-Funded
Work Title
Bids Are Invited For Chips High-Throughput High-Resolution X-Ray Laminography/Tomography System For Advanced Packaged Semiconductor Devices And Substrates
Bid Type
ICB — International Competitive Bid
Country
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Geographical Region
Northern America
Political Region
Asia-Pacific Economic Cooperation, APEC,APAC (Asia Pacific)
Last Date of Bid Submission
09-03-2026
Closed
Work Detail
Chips High-Throughput High-Resolution X-Ray Laminography/Tomography System For Advanced Packaged Semiconductor Devices And Substrates. 6640 - Laboratory Equipment And Supplies. 334413 - Semiconductor And Related Device Manufacturing
Key Value
Tender Value
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Tender Documents
Global Tender Document
956da5b9-fabf-4f3f-bbb7-46c53a80f196.html
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