Tenders Are Invited For Whcsot G6 Semiconductor Display Expansion Project(1)

Tender Detail

108936341
4197-2140CSOTWHT5/274
Self-Funded
Tenders Are Invited For Whcsot G6 Semiconductor Display Expansion Project(1)
NCB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
06-03-2026

Work Detail

Dry Etcher (Additional P/C), Large board Light On Inspection, Film thickness measuring machine, Module Chip Bonding On Glass Machine, Module Flexible Circuit Bonding On Glass Machine, ITO Sputter, Sputter, Imaging brightness optical system, Color Demura Camera Device, Coater & Developer

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