Bids Are Invited For Procurement Of Uta High Density Modular Data Center Infrastructure Solution

Tender Detail

108627277
5360-2-LR26
Self-Funded
Bids Are Invited For Procurement Of Uta High Density Modular Data Center Infrastructure Solution
NCB
South America
Asia-Pacific Economic Cooperation, APEC,APAC (Asia Pacific)
09-03-2026

Work Detail

The University Requires The Acquisition Of A Modular-Intelligent Rack System, With The Provision Of Integrated Precision Air Equipment And Ups For Server Clusters According To The Technical Specifications Indicated In Annex No. 2. Cost Center 4336-4536.

Key Value

Tender Value
68,50,00,000 - CLP

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