Tenders Are Invited For Manual Device For Precise Placement Of Components And Chips – Repeated Procurement Procedure

Manual Device For Precise Placement Of Components And Chips – Repeated Procurement Procedure. The Subject Of The Order Is The Supply Of Hand-Held Equipment For The Precise Assembly Of Components And Chips, Especially Bare Chips Of Integrated Circuits, Transistors, Diodes And Other Components In Micrometric Dimensions. Micrometric Displacements And Pressure Force Measurement During Mounting Ensure A Safe And Reliable Process, Which Is Nowadays In The Field Of Semiconductor Production, Or Chip Encapsulation Required. In Addition To Mounting, It Is Possible To Dispense Adhesives In Very Small Quantities, And In The Future It Is Possible To Further Expand The Device With Modules Ensuring Modern Ways Of Connecting Chips To The Circuit (Flip-Chip). The Subject Of The Public Contract Is Defined In Detail By The Technical, Commercial And Other Contractual Conditions That Are Part Of The Tender Documentation. ------ The Subject-Matter Of The Public Contract Is The Supply Of A Manual Device For Precise Placement Of Components And Chips, In Particular Bare Integrated Circuit Chips, Transistors, Diodes And Other Components Of Micrometric Dimensions. Micrometric Positioning And Measurement Of Placement Force Ensure A Safe And Reliable Process, Which Is Nowadays Essential In The Field Of Semiconductor Manufacturing, Specifically In Chip Packaging. In Addition To Placement, The Device Enables The Dispensing Of Adhesives In Very Small Quantities And, Due To Its Modular Design, It Can Be Further Extended In The Future By Modules Providing Modern Methods Of Chip Interconnection (Flip-Chip). The Subject-Matter Of The Public Contract Is Further Specified By The Technical, Commercial And Other Contractual Conditions, Which Form An Integral Part Of The Procurement Documents.