Tenders Are Invited For Whcsot G6 Semiconductor Display Expansion Project(1)

Tender Detail

104555262
4197-2140CSOTWHT5/269
Self-Funded
Tenders Are Invited For Whcsot G6 Semiconductor Display Expansion Project(1)
NCB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
02-12-2025

Work Detail

Pumping Line, Vacuum Cold Dry, Robot, Conveyor, Module Flexible Circuit Bonding On Glass Machine, Module PCB Bonding On Glass Machine, Cover Glass Cleaning And Laminating Machine, AOI, Array High Auto Optical Inspection, Array Laser Repair, Repair, Array Tester Probe, Mask AOI, Array Tester, Bonding Machine, Module Dispenser Machine, shipment film applicator, FPC Bending Film Lamination Machine, Pattern Generator

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Global Tender Document 5922fe5c-9b9f-47ad-9069-ac7318d9135d.html
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