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    • Tenders Are Invited For Wuxi Xishan District Semiconductor Advanced Manufacturing Innovation Center Grinding Wheel Test Platform Procurement Project

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    101714692
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    JSZC-320205-THGC-G2025-0055
    Self-Funded
    Tenders Are Invited For Wuxi Xishan District Semiconductor Advanced Manufacturing Innovation Center Grinding Wheel Test Platform Procurement Project
    NCB
    You can view only after subscription.
    Eastern Asia
    Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC (Asia Pacific)
    13-10-2025

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    Procurement Announcement Of The Grinding Wheel Test Platform Procurement Project Of Xishan District Semiconductor Advanced Manufacturing Innovation Center In Wuxi
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