Machines And Apparatus With Individual Functions- Procurement Of A Hybrid Plasma Etching And Coating System. The Procurement Procedure Described Here Concerns The Procurement Of A System For Atomic System Separation (Atomic Layer Deposition, Ald) And Atomic Sets (Atomic Layer Etching, Ale) For Plasma -Supported Processes For Separation At Low Temperatures. In Addition, The System Must Have A Bias-Capable Electrode In Order To Carry Out Classic Parallel Slabs-Rie Processes. The Vacuum System Must Be Able To Regulate The Process Pressure Stable Using A Wide Pressure Area, Since Ald Processes Usually Require Higher Pressures Than Rie Processes. In Addition, All Essential Functions Of A Rie And A Pe Ald Must Be Fully Fulfilled, As Are Listed In The Minimum Requirements Of The Tender. Rie Processes With Capacitively Coupled Plasma And Chemical Departure Processes As Ic Pecvd Must Also Be Feasible.
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