Tender Notice |
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| TDR | 54441503 |
| Tendering Authority | Indian Army |
| Tender No | GEM/2026/B/7322149 |
| Tender ID | GEM/2026/B/7322149 |
| Tender Brief | Bids Are Invited For 640X480 Thermal Imaging Core , Ir Sensor Module , Thermal Lens Assembly , Dual Sensor Integration Board , Heat Signature Processing Interface Total Quantity : 5 |
| City | Dehradun |
| State | Uttarakhand |
| Document Fees | Refer document |
| EMD | Refer document |
| Tender Value | INR 1 Lakhs /- |
| Tender Type | Tender |
| Bidding Type | Open Tender |
| Competition Type | Indian |
Tender Details |
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Bids Are Invited For 640X480 Thermal Imaging Core , Ir Sensor Module , Thermal Lens Assembly , Dual Sensor Integration Board , Heat Signature Processing Interface Total Quantity : 5 |
Key Dates |
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| Publish Date | 05-03-2026 |
| Last Date of Bid Submission | 16-03-2026 |
| Tender Opening Date | 16-03-2026 |
Contact Information |
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| Company Name | Indian Army |
| Address | Dehradun |
Other Detail |
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| Information Source | https://gem.gov.in/ | ||||||||
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