}
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    • Bids Are Invited For Xilinx Virtex- 7 Fpga Vc709 Connectivity Kit (Q3) Total Quantity : 1, indore-Madhya Pradesh

    Department of Higher Education has published Bids Are Invited For Xilinx Virtex- 7 Fpga Vc709 Connectivity Kit (Q3) Total Quantity : 1. Submission Date for this Tender is 06-04-2023. Printed Circuit Assemblies Tenders in indore Madhya Pradesh. Bidders can get complete Tender details and download the document.




    Tender Notice

    37003230
    Bids Are Invited For Xilinx Virtex- 7 Fpga Vc709 Connectivity Kit (Q3) Total Quantity : 1
    Open Tender
    Indian
    Madhya Pradesh
    Indore
    06-04-2023

    Tender Details

    Bids Are Invited For Xilinx Virtex- 7 Fpga Vc709 Connectivity Kit ( Q3 ) Total Quantity : 1

    Key Value

    Document Fees
    Refer document
    EMD
    INR 27000.0 /-
    Tender Value
    Refer document
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