}

Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached) Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached), Bengaluru Urban-Karnataka

Council Of Scientific And Industrial Research-CSIR has published Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached) Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached). Submission Date for this Tender is 03-02-2022. Spare Part Tenders in Bengaluru Urban Karnataka. Bidders can get complete Tender details and download the document.




Tender Notice

30777586
Corrigendum : Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached) Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached)
Single
Indian
Karnataka
Bengaluru Urban
03-02-2022

Tender Details

Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached) Tender For 8L Qfn-3 X 3 0.09 Type-1 And Type-2 Chip Assembly (As Per Bill Of Material List Attached)

Corrigendum Details

Sr No CorrigendumDate Corrignedum CorrigendumType NewSubmissionDate
1 27-Jan-2022 Bid Auto Extn Corrigendum Bid Auto Extn Corrigendum 03-02-2022

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