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Bids Are invited for Printed circuit boards for scintillation logging probe with graphic displays - Printed circuit boards for scintillation logging probe with graphic displays (specifications as per annexure I, Terms and conditions as per annexure VIII. -Andhra Pradesh

Department Of Atomic Energy has published Bids Are invited for Printed circuit boards for scintillation logging probe with graphic displays - Printed circuit boards for scintillation logging probe with graphic displays (specifications as per annexure I, Terms and conditions as per annexure VIII. . Submission Date for this Tender is 20-12-2021. Printed Circuit Assemblies Tenders in Andhra Pradesh. Bidders can get complete Tender details and download the document.




Tender Notice

30011486
Corrigendum : Bids Are invited for Printed circuit boards for scintillation logging probe with graphic displays - Printed circuit boards for scintillation logging probe with graphic displays (specifications as per annexure I, Terms and conditions as per annexure VIII.
Open Tender
Indian
Andhra Pradesh
20-12-2021

Tender Details

Bids Are invited for Printed circuit boards for scintillation logging probe with graphic displays - Printed circuit boards for scintillation logging probe with graphic displays (specifications as per annexure I, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) , FPGA based multilayer printed circuit boards for gamma ray spectrometry - FPGA based multilayer printed circuit boards for gamma ray spectrometry (specifications as per annexure II, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) , FPGA based multilayer printed circuit boards for borehole gamma ray spectrometry - FPGA based multilayer printed circuit boards for borehole gamma ray spectrometry (specifications as per annexure III, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) , Digital microcontroller based printed circuit boards for data acquisition system - Digital microcontroller based printed circuit boards for data acquisition system (specifications as per annexure IV, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) , Digital microcontroller based printed circuit boards for borehole data logging - Digital microcontroller based printed circuit boards for borehole data logging (specifications as per annexure V, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) , Digital microcontroller based printed circuit boards for surface acquisition module - Digital microcontroller based printed circuit boards for surface acquisition module (specifications as per annexure VI, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) , Battery Packs - Battery packs (specifications as per annexure VII, Terms and conditions as per annexure VIII. Compliance sheet should be filled by firm.) Total Quantity : 1

Corrigendum Details

Sr No CorrigendumDate Corrigendum CorrigendumType NewSubmissionDate
1 08-12-2021 20-12-2021

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