Tenders Are Invited For Guangzhou Qinglan Semiconductor Co., Ltd. Automatic Glue Injection And Sealing And Automatic Module Gluing And Assembly And Curing Equipment Project

Tender Detail

54596261
0623-2240J1110206/02
Self-Funded
Tenders Are Invited For Guangzhou Qinglan Semiconductor Co., Ltd. Automatic Glue Injection And Sealing And Automatic Module Gluing And Assembly And Curing Equipment Project
ICB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20,APAC ( Asia Pacific)
14-09-2022

Work Detail

Project Name: Guangzhou Qinglan Semiconductor Co., Ltd. Automatic Glue Injection And Sealing And Automatic Module Gluing And Assembly And Curing Equipment Project Tenders Are Invited For Guangzhou Qinglan Semiconductor Co., Ltd. Automatic Glue Injection And Sealing And Automatic Module Gluing And Assembly And Curing Equipment Project Products List: 1: Automatic Glue Injection And Sealing Equipment 2: Automatic Module Gluing, Assembling And Curing Equipment Place Of Implementation: Guangdong Province, China Beginning Of Selling Bidding Documents: 2022-08-24 Ending Of Selling Bidding Documents: 2022-08-31 Price Of Bidding Documents: 500/$80 Deadline For Submitting Bids/Time Of Bid Opening (Beijing Time): 2022-09-14 10:00 Tender Link : Https://Www.Chinabidding.Com/En/Detail/253273645-Bidnoticeen.Html

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