Tenders Are Invited For Spice Device Simulation Software

Tender Detail

42528249
0705 214020603466
Self Funded
Tenders Are Invited For Spice Device Simulation Software
ICB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20
25-08-2021

Work Detail

Project Name Spice Device Simulation SoftwareTenders Are Invited For 12 Inch Advanced Production Line Construction ProjectProducts List 1 Spice Device Simulation SoftwarePlace Of Implementation Shanghai ChinaBeginning Of Selling Bidding Documents 2021 07 27Ending Of Selling Bidding Documents 2021 08 03Price Of Bidding Documents 1000 150Deadline For Submitting Bids Time Of Bid Opening Beijing Time 2021 08 25 14 30

Key Value

Tender Value
Refer document

Attachment

FileName File Description
Global Tender Document Tender Notice
Attachments
Additional Details Available on Click
✓ Tendering Authority
✓ Publication Document
(Tender Document / Tender Notice )
Disclaimer :
We takes all possible care for accurate & authentic tender information, however Users are requested to refer Original source of Tender Notice / Tender Document published by Tender Issuing Agency before taking any call regarding this tender.
Tell us about your Product / Services,
We will Find Tenders for you

Copyright © 2024 · All Rights Reserved. Terms of Usage | Privacy Policy

For Tender Information Services Visit : TenderDetail