Tenders are invited for Auto Wafer Laser Saw

Tender Detail

41545791
0613 214522152559 02
Self Funded
Tenders are invited for Auto Wafer Laser Saw
ICB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20
12-07-2021

Work Detail

Project Name Auto Wafer Laser SawTenders Are Invited For Semiconductor Manufacturing Electronics Shaoxing Corporation To Purchase A Batch Of EquipmentsProducts List 1 Ipm Tester2 Auto Wafer Laser SawPlace Of Implementation Shao XingBeginning Of Selling Bidding Documents 2021 06 21Ending Of Selling Bidding Documents 2021 06 28Price Of Bidding Documents 500 80Deadline For Submitting Bids Time Of Bid Opening Beijing Time 2021 07 12 10 00

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