Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The Topic
Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The Topic
Asia-Pacific Economic Cooperation, APEC,Association of Southeast Asian Nations, ASEAN
28-05-2021
Work Detail
Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The TopicDate Approval 28 02 2021Package 1Type GoodsName 87 2021 Vht K1 M Ve18 Procurement Of Printed Circuit Boards And Soldering Boards For Assembling MaterialsPrice 1 609 535 598Package 2Type GoodsName 88 2021 Vht K1 M Ve18 Procurement Of Fpga ChipsPrice 833 470 000Package 3Type GoodsName 89 2021 Vht K1 M Ve18 Procurement Of Mechanical Case Control Box Antenna Microwave 4 Pin Holder Price 465 806 000Package 4Type GoodsName 90 2021 Vht K1 M Ve18 Procurement Of Switches Lan Cables And Power CablesPrice 189 860 000 Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document
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