Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The Topic

Tender Detail

38025589
20210300859 00
Self Funded
Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The Topic
ICB
South-Eastern Asia
Asia-Pacific Economic Cooperation, APEC,Association of Southeast Asian Nations, ASEAN
28-05-2021

Work Detail

Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The TopicDate Approval 28 02 2021Package 1Type GoodsName 87 2021 Vht K1 M Ve18 Procurement Of Printed Circuit Boards And Soldering Boards For Assembling MaterialsPrice 1 609 535 598Package 2Type GoodsName 88 2021 Vht K1 M Ve18 Procurement Of Fpga ChipsPrice 833 470 000Package 3Type GoodsName 89 2021 Vht K1 M Ve18 Procurement Of Mechanical Case Control Box Antenna Microwave 4 Pin Holder Price 465 806 000Package 4Type GoodsName 90 2021 Vht K1 M Ve18 Procurement Of Switches Lan Cables And Power CablesPrice 189 860 000 Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document

Key Value

Tender Value
96,80,85,91,000 - VND

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