Automatic Packaging System of Precision Photoelectric Devices Procurement of Hebei Semiconductor Research Institute

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32268240
0722 204FE2071HBF
Self Funded
Automatic Packaging System of Precision Photoelectric Devices Procurement of Hebei Semiconductor Research Institute
ICB
Eastern Asia
Asia-Pacific Economic Cooperation, APEC,BRIC,G20
31-08-2020

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Project Name Automatic packaging system of precision photoelectric devices procurement of hebei semiconductor research instituteTenders are invited for In this Project Hebei Semiconductor Research Institute Entrusts China Far East International Bidding Co Ltd To Purchase a Set of Automatic Packaging System of Precision Photoelectric Devices through International Competitive Public Bidding Products List 1 Automatic Packaging System for Precision Photoelectric DevicesPlace of Implementation Hebei ChinaBeginning of Selling Bidding Documents 2020 08 06Ending of Selling Bidding Documents 2020 08 13Price of Bidding Documents FreeDeadline for Submitting Bids Time of Bid Opening Beijing Time 2020 08 31 09 30

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