Contract Notice Laboratory Optical And Precision Equipments Excl Glasses Silicon Austria Labs Bond Alignment SystemDescription The Aim Of The Present Award Procedure Is To Commission The Best Bidder Identified In The Course Of The Award Procedure With The Delivery And Installation Of A Bond Alignment System In The Clean Room Of Silicon Austria Labs Gmbh A Bond Alignment System Is A System Capable Of Aligning Wafers To Each Other In The Micrometer Range It Is Used For The Packaging Of 3D Systems And In Particular Of Wafer Stacks The Bond Alignment System Is To Be Installed In The Existing Sal Cleanroom In Villach Together With A Wafer Bonder Time Limit For Receipt Of Tenders Or Requests To Participate Date 12 08 2019 Local Time 12 00 Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document
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