Global Tenders
Tender Notice |
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| GTR | 117944407 |
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| Tendering Authority | Empire State Development |
| Work Title | Bids Are Invited For Downstate Semiconductor Chip Design Center |
| Country | United States |
| GeoGraphical Region | Northern America |
| Political Region | Asia-Pacific Economic Cooperation, APEC,APAC (Asia Pacific) |
| Tender Value | Ref. Document |
| ICB | ICB |
| Financer Name | Self-Funded |
Work Detail
Downstate Semiconductor Chip Design Center
Key Dates
| Last Date of Bid Submission | 26-10-2026 |
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Contact Information
| Company Name | Empire State Development |
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Other Detail
| Information Source | https://www.nyscr.ny.gov |
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View Original Notice/Document
| Download | FileName |
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| Download | 4a953a56-daab-4dde-a1df-e75aff6ca388.html |
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