Tender Details |
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| BRR | 10867486 |
| Tendering Authority | Department of Defence Production |
| Tender No | GEM/2025/B/6202260 |
| Tender ID | GEM/2025/B/6202260 |
| Tender Brief | bids are invited for 51178274 14 layer-2.33mm-foilmethod, jd3mc graphics card pn: m1020103002, ms. micropack , 51178349 14 layer-1.6mm-foilmethod, jd3mc iotp2 card pn m1020107002 pkg micro pack , 51178478 pcb, 14 layer-1.86mm-foilmethod, grade: mil-prf-55100g, jd3mc iotp3 card, pn m102010 , 51178610 18 layer- 2.3m 10% foilmethod, jd3mc carrier card pn m1020102003 pkg micropack , 51178658 stroke c |
| City | Rangareddi |
| State | Telangana |
| Tender Value | Ref. Documents |
| Due Date | 27-05-2025 |
Work Detail |
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bids are invited for 51178274 14 layer-2.33mm-foilmethod, jd3mc graphics card pn: m1020103002, ms. micropack , 51178349 14 layer-1.6mm-foilmethod, jd3mc iotp2 card pn m1020107002 pkg micro pack , 51178478 pcb, 14 layer-1.86mm-foilmethod, grade: mil-prf-55100g, jd3mc iotp3 card, pn m102010 , 51178610 18 layer- 2.3m 10% foilmethod, jd3mc carrier card pn m1020102003 pkg micropack , 51178658 stroke card pcb, 12 layered fr4 pcb, thickness: 1.93mm size: 143.75mm x 74mm, p-n: m1020105 , 51178757 video card pcb, m1020104002, 12layer-2mm-foilmethod, p-n m1020104002, grade: mil-prf-55110g (a , 51178120 jd3mc asio card 12 layers, 2.38mm 10% thickness, p-n m1020106000 rev 00 micro pack , 51178151 18-layer- 4.25mm-foilmethod, jd3mc vpx backplane card. p-n: m1020101000, mfg: micropack. , 51178197 12 layer- 1.6mm-foilmethod, jd3mc iotp1 card p-n m1020107001 rev 00 pkg micro pack , printed circuit board total quantity : 401 |
Tender Result Details |
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| Bidder List |
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| Contract Date | Ref. Document | |
| Contract Value | 1.26 Crore | |
| Contractor Name | micropack private limited | |
Information Source |
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| https://gem.gov.in/ | |
View Original Notice/Document |
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